Microelectronics Reliability-Physics-Of-Failure Based Modeling and Lifetime Evaluation
Hence, we have developed this guideline document as an approach for system designers and
device reliability engineers to develop a better understanding of device failures as a result of
wearout, and to provide a better understanding of how current reliability models are applied in
practice. We describe the best possible approaches to modeling reliability concerns in some of the
more advanced microelectronic technologies, and provide in-depth descriptions on how to
implement into reliability equivalent circuits for spacecraft, planets, instrument, C-matrix, events
(SPICE) simulation. Within the inherent limitations of high-power, high-speed, commercial
Complementary Metal Oxide Semiconductor (CMOS) devices, suggestions are developed on how
to model the incipient failure rate, how to trade circuit performance with reliability, and how to
obtain a predictable end-of-life or component-level system repair rate through realistic timedependent
reliability prediction.
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